详细参数:
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FDKˇs chip baluns are developed by FDKˇs original material technology, simulation technology, and high frequency technology. Its small size, high efficiency and low power consumption should be perfect match for mobile communication equipment.
In addition to the conventional AMB1608 series, which can be applied DC-Bias, ¨AMB1005 series〃 are newly lineuped and the world smallest baluns.
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Model/Series |
Size |
Application |
PDF |
AMB1608 |
1.6 x 0.8 x 0.6mm |
Bluetooth, W-LAN, WiMAX, etc |
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AMB1005 |
1.0 x 0.5 x 0.4mm |
Bluetooth, W-LAN, WiMAX, etc |
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